| 摘要 |
The present invention discloses a semiconductor radiator, a hollow thermally insulating stand and a lower heat conductive connection base are arranged on an upper end and a lower end of the through hole arranged on an electrically and thermally insulating rigid substrate respectively, a stage which extends through the through hole and cooperates with a cavity of the hollow thermally insulating stand is arranged on the lower heat conductive connection base, a top surface of the stage is attached to a bottom surface of a semiconductor cooling plate arranged on the top of the hollow thermally insulating stand, an upper heat conductive connection base is attached to a top surface of the semiconductor cooling plate. The present invention has a simple structure, a good anti-dust capability, a noise-free feature, a stable and reliable heat dissipation performance, and easy installation. |
| 主权项 |
1. A semiconductor radiator, comprising an electrically and thermally insulating rigid substrate (1) containing a through hole, wherein a hollow thermally insulating stand (2) and a lower heat conductive connection base (3) are arranged at an upper end and a lower end of the through hole, respectively, a stage which extends through the through hole and cooperates with a cavity of the hollow thermally insulating stand (2) is arranged on the lower heat conductive connection base (3), a top surface of the stage is attached to a bottom surface of a semiconductor cooling plate (5) arranged on the top of the hollow thermally insulating stand (2), an upper heat conductive connection base (6) is attached to a top surface of the semiconductor cooling plate (5), and a number of heat dissipation means (7) are fastened on each of an upper surface of the upper heat conductive connection base (6) and a bottom surface of the lower heat conductive connection base (3). |
