发明名称 RUN FLAT TIRE
摘要 A run flat tire having a side reinforcing rubber part is disclosed. The side reinforcing rubber part is formed by a rubber composition having a ratio (M50H/M50N) of tensile stress (M50H) in 50% elongation at a measurement temperature of 100° C. to tensile stress (M50N) in 50% elongation at a measurement temperature of 23° C. of from 1.0 to 1.3. A ratio (M50H/M50F) of tensile stress (M50H) in 50% elongation at a measurement temperature of 100° C. of the rubber composition forming the side reinforcing rubber part to tensile stress (M50F) in 50% elongation at a measurement temperature of 100° C. of a rubber composition forming a bead filler is from 0.5 to 1.3.
申请公布号 US2015352910(A1) 申请公布日期 2015.12.10
申请号 US201514721442 申请日期 2015.05.26
申请人 Toyo Tire & Rubber Co., Ltd. 发明人 Taniguchi Sho
分类号 B60C17/00;C08L61/06;C08L9/00;C08L71/00;B60C5/00;C08L7/00 主分类号 B60C17/00
代理机构 代理人
主权项 1. A run flat tire comprising a tread part, a pair of side wall parts extending inside in a radial direction from both ends of the tread part, a pair of bead parts provided inside in a radial direction of the side wall part, a pair of ring-shaped bead cores provided in the bead parts, a carcass ply extending in a toroidal shape between a pair of the bead cores, a bead filler provided on the periphery of the bead core, and a side reinforcing rubber part provided in the side wall part and reinforcing the side wall part, wherein the side reinforcing rubber part is formed by a rubber composition in which a ratio (M50H/M50N) of tensile stress (M50H) in 50% elongation at a measurement temperature of 100° C. to tensile stress (M50N) in 50% elongation at a measurement temperature of 23° C. is from 1.0 to 1.3, and a ratio (M50H/M50F) of tensile stress (M50H) in 50% elongation at a measurement temperature of 100° C. of the rubber composition forming the side reinforcing rubber part to tensile stress (M50F) in 50% elongation at a measurement temperature of 100° C. of a rubber composition forming the bead filler is from 0.5 to 1.3.
地址 Osaka JP