Methods and Apparatus for Applying Adhesives in Patterns to an Advancing Substrate

摘要

The present disclosure involves methods and apparatuses for applying fluids onto an advancing substrate having an unconstrained caliper, Hs. The fluid application apparatus may include a slot die applicator and a substrate carrier, wherein the slot die applicator includes a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier includes a base surface and a pattern element that includes a pattern surface and protrudes outward from the base surface. The substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate. Embodiments of apparatuses may be configured to monitor; establish; maintain; and/or change the desired minimum distance, Hg, before and/or during operation.

主权项

1. A method for applying a fluid to a substrate in a pattern, the method comprising the steps of:
providing a slot die applicator comprising a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; providing a substrate carrier comprising a pattern element, wherein the pattern element comprises a pattern surface; positioning the slot die applicator adjacent the substrate carrier to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip; advancing the substrate to the substrate carrier, the substrate having a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, wherein the unconstrained caliper, Hs, of the substrate is greater than minimum distance, Hg; advancing the second surface of the substrate past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; discharging fluid from the slot opening of the slot die applicator onto the second surface of the substrate in a pattern area having a shape that corresponds with a shape of the pattern surface on the substrate carrier by advancing the pattern surface of the pattern element past the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and moving the first lip and the second lip of the slot die applicator either away from or toward the pattern surface to maintain the minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip.