| 发明名称 |
LEAD-FREE EUTECTIC SOLDER ALLOY COMPRISING ZINC AS THE MAIN COMPONENT AND ALUMINUM AS AN ALLOYING METAL |
| 摘要 |
Lead-free solder alloy comprising zinc (Zn) as the main component and aluminum (Al) as an alloying metal, wherein the solder alloy is a eutectic having a single melting point in the range of 320 to 390 °C (measured by DSC at a heating rate of 5 °C min-1). |
| 申请公布号 |
WO2015160311(A3) |
申请公布日期 |
2015.12.10 |
| 申请号 |
WO2015SG50073 |
申请日期 |
2015.04.15 |
| 申请人 |
HERAEUS MATERIALS SINGAPORE PTE. LTD. |
发明人 |
PAN, WEI CHIH;BAQUIRAN, JOSEPH AARON MESA;REYNOSO, INCIONG |
| 分类号 |
B23K35/28;B23K1/00;B23K35/02;B23K35/26;C22C11/00;C22C13/00;C22C18/00;C22C18/04 |
主分类号 |
B23K35/28 |
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