| 摘要 |
Provided is a wafer dryer which removes moisture from a wafer by using a heater. The wafer dryer includes i) a base, ii) a wafer holding unit which is located on the base, and separates a plurality of wafers from one another to support the wafers, iii) a plurality of flat heaters which are located on the base to be separated from one another, are adjacent to the wafer holding unit, and are inserted between the wafers, iv) a flat heater holder which is located on the base, and separates the flat heaters from one another to support the heaters, and v) a pair of guide rails which are located on the base, are connected to one from the flat heaters and the wafer holding unit, and allows the flat heaters to be overlapped with the wafer holding unit. |
