| 摘要 |
PROBLEM TO BE SOLVED: To provide: a printed wiring board in which a surface of an insulating layer can be increased in flatness higher than that of the conventional ones, an outermost conductive circuit layer being laminated on the surface; and a method for manufacturing the printed wiring board.SOLUTION: In a printed wiring board 10 of the present invention, a second insulating layer 17 thinner than a first insulating layer 16 is laminated on an outermost conductive circuit layer 21 side in the first insulating layer 16 disposed below an outermost conductive circuit layer 21, and thereby fine irregularities of the first insulating layer 16 are buried by the second insulating layer 17, so that an outermost conductive circuit layer 21 side in the second insulating layer 17 can be made flatter than a first insulating layer 16 side. Thus, a surface of an insulating layer 15 comprising the first insulating layer 16 and the second insulating layer 17 can be increased in flatness higher than that of the conventional ones, the outermost conductive circuit layer 21 being laminated on the surface. |
