发明名称 MANUFACTURING METHOD FOR CAMERA MODULE
摘要 A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.
申请公布号 US2015358517(A1) 申请公布日期 2015.12.10
申请号 US201514826438 申请日期 2015.08.14
申请人 MURATA MANUFACTURING CO., LTD. 发明人 IKEMOTO Nobuo;KUMANO Atsushi;HSIEH Jerry;SASAKI Jun
分类号 H04N5/225;H05K3/00;H05K5/00;H01L27/146 主分类号 H04N5/225
代理机构 代理人
主权项 1. A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween, the manufacturing method comprising: a first step of forming the multilayer body by stacking and combining a plurality of first members; and a second step of forming a through hole in the plurality of first members that constitute at least a portion of the multilayer body to form the optical path defined by the through hole; wherein the multilayer body includes a cavity opening inward from a first surface in a stacking direction; the through hole extends from a bottom surface of the cavity to a second surface of the multilayer body in the stacking direction; and in the second step, the second surface of the multilayer body is set in contact with a flat or substantially flat working surface, and the through hole is formed from a side of the first surface of the multilayer body.
地址 Nagaokakyo-shi JP