METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE

摘要

In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.

主权项

1. A method for processing semiconductor die comprising:
providing a semiconductor wafer having a plurality of semiconductor die formed on the semiconductor wafer and separated from each other by spaces, wherein the semiconductor wafer has first and second opposing major surfaces; placing the semiconductor wafer onto a first carrier substrate; singulating the semiconductor wafer through the spaces to form singulation lines adjacent the plurality of semiconductor die; and reducing the presence of residual contaminants from surfaces of the plurality of semiconductor die using a first fluid.