INSPECTION APPARATUS, INSPECTION METHOD, EXPOSURE SYSTEM, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD

摘要

In order to inspect each processing condition among a plurality of processing conditions with high accuracy using a substrate having a pattern processed under the plurality of processing conditions, an inspection apparatus is provided with: a stage which is capable of holding a wafer having a pattern formed thereon under a plurality of exposure conditions; an illumination system which illuminates the surface of the wafer with polarized light; an imaging device and an image processing section which receive light emitted from the surface of the wafer, and detect a condition for prescribing the polarization state of the light; and a computing section which determines an apparatus condition for determining the exposure condition of the pattern on the basis of the condition for prescribing the polarization state of light emitted from a condition-parameterizing wafer having a pattern formed thereon under a known exposure condition.

主权项

1. An inspection apparatus configured to determine a processing condition for a pattern, the apparatus comprising:
a stage configured to hold a substrate having a pattern formed on a surface thereof; an illuminator configured to illuminate the surface of the substrate with polarized light; a detector configured to receive light emitted from the surface of the substrate and detect a condition for prescribing a polarization state of the light; a storage configured to store an apparatus condition for determining the processing condition of an inspection target pattern formed on a surface of an inspection target substrate based on a condition for prescribing the polarization state of light emitted from a substrate having a pattern formed thereon under the known processing condition; and an inspector configured to determine the processing condition of the inspection target pattern on the basis of a condition for prescribing the polarization state of light emitted from the surface of the inspection target substrate under the apparatus condition.