发明名称 ABSORBING-LAYER-FORMING COMPOSITION AND ABSORBING SUBSTRATE, PRINTED ITEM, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT PRODUCED USING THE SAME
摘要 The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.
申请公布号 US2015353747(A1) 申请公布日期 2015.12.10
申请号 US201414762789 申请日期 2014.01.16
申请人 DIC CORPORATION 发明人 FUJIKAWA Wataru;SHIRAKAMI Jun;MURAKAWA Akira;SAITOU Yukie
分类号 C09D11/102;C09D11/52;B41J2/01;H05K1/09;H05K3/12 主分类号 C09D11/102
代理机构 代理人
主权项 1. An absorbing-layer-forming composition comprising a blocked isocyanate (A) such that the amount of the blocked isocyanate (A) is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition.
地址 Tokyo JP