An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
申请公布号
EP2952076(A1)
申请公布日期
2015.12.09
申请号
EP20130873193
申请日期
2013.01.31
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
FRANZ, JOHN P.;CADER, TAHIR;SABOTTA, MICHAEL L.;MOORE, DAVID A.