发明名称 PLASMA PROCESSING METHOD
摘要 The present invention, in a plasma processing method using an inductively coupled plasma etching apparatus comprising a Faraday shield, provides a plasma processing method capable of performing an etching process and a film forming process on a magnetic film in one processing chamber. According to the plasma processing method for performing plasma etching on a magnetic film using a plasma processing apparatus comprising: a processing chamber where a sample is plasma-processed; a dielectric window which air-tightly seals an upper part of the processing chamber; an inductively coupled antenna arranged in an upper part of the dielectric window; a high frequency power source for supplying high frequency electricity to the inductively coupled antenna; and a Faraday shield which is arranged between the inductively coupled antenna and the dielectric window, the magnetic film is plasma-etched and then a deposited film is formed on the magnetic film plasma-etched by the plasma processing while applying a high frequency voltage to the Faraday shield.
申请公布号 KR20150137936(A) 申请公布日期 2015.12.09
申请号 KR20140097288 申请日期 2014.07.30
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 ABE TAKAHIRO;YAMAMOTO NAOHIRO;SUYAMA MAKOTO;ISHIMARU MASATO
分类号 H01L21/3065;H05H1/46 主分类号 H01L21/3065
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