发明名称 MULTILAYER ENCAPSULATION WITH INTEGRATED GAS PERMEATION SENSOR
摘要 According to one embodiment of the present invention, barrier stacks provide early indication of a barrier failure. According to another embodiment, the barrier stack comprises one or more dyads comprising a first polymer decoupling layer and a second barrier layer. The barrier stack comprises one or more integrated gas permeation sensors between the first and second layers of one dyad, or between two dyads. According to another embodiment, the barrier stack can comprise: a primary barrier stack comprising one or more dyads; one or more integrated gas permeation sensor laterally spaced apart from the primary barrier stack; and a secondary barrier stack comprising one or more dyads on the primary stack and the integrated gas permeation sensor.
申请公布号 KR20150138114(A) 申请公布日期 2015.12.09
申请号 KR20150076611 申请日期 2015.05.29
申请人 SAMSUNG SDI CO., LTD. 发明人 DAMIEN BOESCH;LORENZA MORO;XIANGHUI ZENG
分类号 H01L51/00;H01L21/56 主分类号 H01L51/00
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