发明名称 熱硬化性樹脂組成物、プリプレグ、積層板、金属箔張積層板、及び回路基板
摘要 Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.
申请公布号 JP5830718(B2) 申请公布日期 2015.12.09
申请号 JP20110103192 申请日期 2011.05.02
申请人 パナソニックIPマネジメント株式会社 发明人 松田 隆史;西野 充修;古森 清孝
分类号 C08L101/00;B32B27/38;C08J5/24;C08K3/10;C08K3/22;H05K1/03 主分类号 C08L101/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利