| 发明名称 |
EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING THE SAME |
| 摘要 |
An epoxy resin composition according of an embodiment of the present invention comprises 10-70 wt% of an epoxy compound and a curing agent, and 30-90 wt% of an inorganic filler including a hollow filler and boron nitride, wherein the boron nitride is contained by 0.1 to 100 parts by weight for 10 parts by weight of the hollow filler. |
| 申请公布号 |
KR20150137585(A) |
申请公布日期 |
2015.12.09 |
| 申请号 |
KR20140065681 |
申请日期 |
2014.05.30 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
OH, WOON SU;PARK, YONG HWA;LEE, JONG SIK;LEE, JI NA |
| 分类号 |
C08L63/00;C08K3/22;C08K3/38;C08K7/28;H05K1/03 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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