| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which makes it possible to form a resin cured product having a high thermal conductivity and high electric insulation. <P>SOLUTION: The resin composition comprises a bifunctional epoxy resin having a biphenyl skeleton, a phenol resin, first alumina whose particle diameter D50 corresponding to cumulative 50% from the small particle size side of the weight cumulative particle size distribution thereof is 7-25 μm, second alumina whose particle diameter D50 is 1 to <7 μm, and third alumina whose particle diameter D50 is <1 μm, and the resin composition is configured such that a content ratio of the phenol resin to the epoxy resin (phenol resin/epoxy resin) is confined to 1.00-1.25 on an equivalent basis. <P>COPYRIGHT: (C)2012,JPO&INPIT |
