| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the technique for improving the productivity of a semiconductor device for a manufacturing method of the semiconductor device including an exposure process which is automatically performed by a control system. <P>SOLUTION: In the manufacturing method of the semiconductor device including processes of carrying a plurality of semiconductor wafers and a reticle into a processing chamber provided to an exposure processing mechanism and performing exposure processing using an exposure device installed in the processing chamber, the reticle has processing conditions for inspection for inspecting itself, and the control system when sensing that an inspection start condition is met (process C101) conveys the reticle to be inspected and a semiconductor wafer for inspection into the processing chamber (process C103), performs exposure processing in the processing chamber (process C104), and then performs development (process C108) to check whether a pattern formed on the semiconductor wafer for inspection is abnormal (process C109). <P>COPYRIGHT: (C)2009,JPO&INPIT |
