| 摘要 |
The present invention provides an encapsulation device comprising: a first barrier layer directly deposited on the device; a first adhesive layer positioned on the first barrier layer; and a first laminate. A method for preparing an encapsulation device comprises: depositing the first barrier layer on a device in an inert environment; applying the first adhesive layer on the first barrier layer in the inert environment; and applying the first laminate on the first adhesive layer in the inert environment. The laminate comprises: a polymeric substrate; and a second barrier layer positioned on the polymeric substrate. The first barrier layer has a water vapor transmission rate suitable to allow lamination of the laminate on the first barrier layer in the inert environment. |
