发明名称 |
THERMAL MANAGEMENT IN LASER DIODE DEVICE |
摘要 |
<p>Embodiments are disclosed that relate to reducing inductive losses and controlling driver and laser diode temperatures in an optical assembly comprising a laser diode. For example, one disclosed embodiment provides an optical assembly comprising a printed circuit board, and a laser diode package and laser diode driver mounted to the printed circuit board. Further, a heat sink is coupled to the laser diode driver and configured to provide a first thermal path for conducting heat from the laser diode driver. Additionally, a coupler may further be coupled to the laser diode package and printed circuit board, wherein the coupler is configured to provide a second, different thermal path for conducting heat from the laser diode package.</p> |
申请公布号 |
EP2951897(A1) |
申请公布日期 |
2015.12.09 |
申请号 |
EP20140705632 |
申请日期 |
2014.01.29 |
申请人 |
MICROSOFT TECHNOLOGY LICENSING, LLC |
发明人 |
CANUMALLA, SRIDHAR;MCNALLY, STEPHEN |
分类号 |
H01S5/022;G06F15/00;H01L21/82;H01S5/024;H01S5/062;H01S5/40 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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