| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition adaptable to solvent development, capable of low-temperature curing, having sufficiently low water absorption, excellent in wet heat resistance, and capable of image formation with good resolution in a thick film. <P>SOLUTION: The photosensitive resin composition includes (A) a polyamic acid having a 5-20C alkylene group in a main chain, (B) a polymerizable compound, and (C) a photopolymerization initiator, wherein the polymerizable compound (B) includes a polymerizable compound having a 6-20C linear or branched chain alkylene group and two or more ethylenically unsaturated groups per molecule. <P>COPYRIGHT: (C)2010,JPO&INPIT |
