| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable fine adjustment of a pressing force, prevent an adhesive from sticking out under being pressed as much as possible, form an adhesive layer with a favorable thickness without causing deformation, and to bond an element to a substrate by means of vacuum thermal bonding. <P>SOLUTION: In a vacuum press bonding apparatus, a lower end of an upper frame member 12 is made to slide and abut to be sealed airtightly at a peripheral portion of a lower frame member 6 by a drive unit to form a vacuum partition, and upper and lower pressure release films P1 and P2 are made to contact an upper face and a lower face of the elements and softened by being heated under atmospheric pressure, the inside of a vacuum chamber is vacuated, and the lower frame member 6 and an intermediate member 10 are relatively moved in a direction to come close to each other, thereby attaining a state where outer periphery portions of the pressure release films P1 and P2 are held airtight in between an upper face of a substrate table of the lower frame member 6 and a lower face of an inner frame body 13, and atmospheric pressure or a pressure higher than atmospheric pressure is applied to upper space of the pressure release film P2 in the vacuum chamber to make the upper and lower pressure release films P1 and P2 close contact with outer surfaces of the substrate C and the element A and bond the element A to the substrate C from both the outer surfaces at uniform pressure. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
