发明名称 |
Elastic wave filter device and manufacturing method of the same |
摘要 |
An elastic wave filter device includes a transmission elastic wave filter chip and a reception elastic wave filter chip. The transmission elastic wave filter chip includes an insulating support substrate, a piezoelectric layer directly or indirectly supported by the support substrate, and an IDT electrode in contact with the piezoelectric layer. The reception elastic wave filter chip includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. The thermal conductivity of the support substrate is higher than the thermal conductivity of either of the piezoelectric layer and the piezoelectric substrate. |
申请公布号 |
US9374062(B2) |
申请公布日期 |
2016.06.21 |
申请号 |
US201414483194 |
申请日期 |
2014.09.11 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Iwamoto Takashi |
分类号 |
H03H9/72;H03H3/08;H03H9/02;H03H9/10;H01J37/317 |
主分类号 |
H03H9/72 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. An elastic wave filter device comprising:
an insulation plate; a transmission elastic wave filter chip disposed on the insulation plate; and a reception elastic wave filter chip disposed on the insulation plate; wherein the transmission elastic wave filter chip includes:
a support substrate made of an insulating material and disposed on the insulation plate;a piezoelectric layer directly or indirectly disposed on the support substrate; andan IDT electrode disposed on the piezoelectric layer; the reception elastic wave filter chip includes:
a piezoelectric substrate disposed on the insulation plate; andan IDT electrode disposed on the piezoelectric substrate; a thermal conductivity of the support substrate is higher than a thermal conductivity of either of the piezoelectric layer and the piezoelectric substrate; and a thermal conductivity of the insulation plate is higher than the thermal conductivity of either of the piezoelectric layer and the piezoelectric substrate. |
地址 |
Kyoto JP |