发明名称 発光モジュール
摘要 Providing the light emitting module which has a streamlined shape, while suppressing a thickness impression of a case unit which contains a light emitting panel. The light emitting module 1 includes: a light emitting panel 3 which has feeding electrodes (3a, 3b) each of which being electrically connected to a positive electrode 2a or a negative electrode 2c of the light emitting unit 2; a circuit board 4 which is electrically connected to the feeding electrodes (3a, 3b) and is configured to supply electric power to the light emitting unit 2; and a case unit 5 in which the light emitting panel 3 and the circuit board 4 are housed. The feeding electrodes (3a, 3b) are arranged at a peripheral region of the light emitting panel 3. The electrical connection between the feeding electrode (3a, 3b) and the circuit board 4 (or the land-board 6) is obtained by a wiring 8 which is elongated from the center region to the peripheral region of the light emitting panel 3. With this configuration, the top portion of the wiring 8 is located nearer the center in relation to the periphery of the light emitting panel 3, and thus the wiring 8 is hardly contacted to the inner surface of the periphery of the case unit 5, thereby enabling the light emitting module 1 to have a streamlined shape.
申请公布号 JP5830711(B2) 申请公布日期 2015.12.09
申请号 JP20100239103 申请日期 2010.10.25
申请人 パナソニックIPマネジメント株式会社 发明人 河地 秀治;住山 重次;深野 智
分类号 F21S2/00;F21V23/00;H01L51/50;H05B33/06 主分类号 F21S2/00
代理机构 代理人
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