发明名称 LED MODULE
摘要 The present invention relates to the field of light emitting diode (LED) lighting lamps. An LED module includes an LED, a printed circuit board (PCB), a lens, a lens mask and a heat dissipation component; the heat dissipation component includes an aluminium-made heat dissipation frame, a heat-conducting fin, a connection assembly part and a plurality of heat dissipation plates, the aluminium-made heat dissipation frame is provided with a plurality of heat dissipation plate mounting holes that are arranged in parallel, the heat dissipation plates are amounted in the heat dissipation plate mounting holes on the aluminium-made heat dissipation frame in an insertion mode, the PCB is fixed on a bottom surface of the aluminium-made heat dissipation frame, and the heat-conducting fin is located between the PCB and the heat dissipation plates on the aluminium-made heat dissipation frame; and the aluminium-made heat dissipation frame is provide with a wire-threading position, and a location of the wire-threading position is between a corresponding electrical interface and a corresponding power-on interface. The LED module has the advantages of having a novel structure, good heat dissipation performance and good waterproof performance, and being suitable for outdoor use, where the heat dissipation performance may be adjusted according to needs by selecting the number of heat dissipation plates, and the modules may be combined freely.
申请公布号 EP2918896(A4) 申请公布日期 2015.12.09
申请号 EP20140864009 申请日期 2014.10.08
申请人 WANG, LINA 发明人 WANG, YUANCHENG
分类号 F21S2/00;F21V5/00;F21V21/002;F21V23/00;F21V29/00;F21V29/508;F21V29/70;F21Y101/02 主分类号 F21S2/00
代理机构 代理人
主权项
地址