| 摘要 |
A suction nozzle (50) which uses suction to hold a component to be mounted to a circuit board is configured to include: a contact surface (114) which closely contacts the component to be mounted; a suction opening (74), opened on the contact surface, for sucking air; a recess (100) formed on the contact surface; and a blow opening (112), opened inside the recess, for blowing air. With this configuration, when air is sucked in from the suction opening and a component to be mounted is in close contact with the contact surface, the suction opening is tightly sealed by the component. This enables suction holding of the component with strong holding force. In addition, when the component is to be released, air is blown from the blow opening opened in the recess, allowing for favorable releasing of the component. Furthermore, since the contact area between the suction nozzle and the component to be mounted is reduced because of the recess formed on the contact surface, more favorable releasing of the component is made possible. |
