SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING

摘要

The present invention relates to a sulfonamide-based polymer for electric gilding copper. The sulfonamide-based polymer is a product of a reaction between sulfonamide and epoxide. The polymer can be used as a leveler in a copper electric gilding bath in order to provide favorable, uniform throwing power. By using the reaction product, it is possible to plate copper or a copper alloy with favorable surface characteristics and physical stability.