| 摘要 |
A package includes a device die, a molding material molding the device die, and a plurality of redistribution lines overlying the device die and the molding material. A laser mark pad is coplanar with one of the redistribution lines, wherein one of the redistribution lines and the laser mark pad are formed of the same conductive material. A polymer layer is over the redistribution lines and the laser mark pad. A tape is attached to the polymer layer. A laser mark penetrates through the tape and the polymer layer. The laser mark is extended to a top section of the laser mark pad. |
