PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a package board and a method for manufacturing the same. According to an embodiment of the present invention, the package board comprises: a first insulating layer; a second insulating layer formed in a lower part of the first insulating layer; a capacitor which is embedded in the first insulating layer, and includes a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; a circuit layer formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layer or the first insulating layer and the second insulating layer to electrically interconnect the same. An upper part of the first electrode is formed to be exposed from the first insulating layer.