PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a package substrate and a method for manufacturing the same. According to an embodiment of the present invention, the package substrate comprises: a first insulating layer having a through-shaped cavity; a capacitor which is arranged in the cavity, and includes a first electrode, a second electrode formed on an upper part of the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed in an upper part of the first insulating layer and the cavity to have the capacitor embedded therein; a circuit layer formed in the first insulating layer and the second insulating layer; and a via for penetrating the second insulating layer to electrically connect the circuit layer and the capacitor.