| 摘要 |
A suction pad for holding a semiconductor package comprises: a base unit, a coupling unit, and a strength reinforcing unit. The base unit supports a lower surface in a lower part of the semiconductor package having a plurality of ball terminals formed in a regular pattern on the lower surface, and has a first vacuum hole formed to provide vacuum pressure from the outside to a center part. The coupling unit is extended from a center part in a lower part of the base unit, is coupled to a fixing hole of an external storing table, and has a second vacuum hole communicated with the first vacuum hole. The strength reinforcing unit is coupled to the inside of the second vacuum hole to prevent shape modification of the coupling unit. |
