发明名称 放熱用絶縁基板及びその製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat radiation insulating substrate in which a ceramic layer, a first metallic layer disposed on one side of the ceramic layer, and a second metallic layer disposed on the opposite side to the ceramic layer disposing side of the first metallic layer and including Ni as an essential element are joined and integrated in a laminating shape, and capable of preventing occurrence of problems such as warpage, cracking, and peering of the insulating substrate. <P>SOLUTION: A heat radiation insulating substrate includes a superelastic alloy layer 4 interposed between a first metallic layer 3 and a second metallic layer 5 of the insulating substrate 1A. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5829403(B2) 申请公布日期 2015.12.09
申请号 JP20110013283 申请日期 2011.01.25
申请人 昭和電工株式会社 发明人 大滝 篤史;采野 大介;大山 茂
分类号 H01L23/36;H01L25/07;H01L25/18 主分类号 H01L23/36
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