| 摘要 |
The present invention provides an LED packaging structure comprising a leadframe, including: a first electrode (104) including a first functional area (104A) and a first extension area (104B) extending from the first functional area: a second electrode (110) including a second functional area (110A) and a second extension area (110B) extending from the second functional area, a cup-shaped insulator (124), wrapping the first and second electrodes, including an emitting concave formed at the inner side of the cup-shaped insulator and exposing the upper surfaces of the first and second functional areas, wherein portions of the first and second extension areas are exposed from the bottom of the outer side of the cup-shaped insulator; an interposed spacer (13 physically separating the first and second electrodes; and an electroplating layer partially covering the surfaces of the first and second electrodes. |
