MULTILAYER WIRING BOARD AND MANUFACTURING METHOD FOR THE MULTILAYER WIRING BOARD

摘要

A method for manufacturing a multilayer wiring board comprises the following steps of: forming a groove (11) on a surface of a first thermoplastic resin substrate (10); forming a modification layer (12b) made of a resin with a lower melting point than a resin which constitutes the first thermoplastic resin substrate by irradiating the surface of the first thermoplastic resin substrate except a surface around the groove with light; filling the groove of the first thermoplastic resin substrate with a flexible conductive material; and thermally compressing a second thermoplastic resin substrate (20) on the surface of the first thermoplastic resin substrate on which the modification layer is formed.