| 摘要 |
The present invention relates to an adhesive film, a dicing/die-bonding film, a method for manufacturing a semiconductor device, and the semiconductor device. The present invention provides an adhesive film capable of manufacturing a high-reliability semiconductor device with good yield and application thereof. The present invention provides an adhesive film used for embedding a first semiconductor component fixed on an adherend and fixing a second semiconductor component different from the first semiconductor component on the adherend, and the dielectric constant of the adhesive film under 1MHz after thermofixation is less than 4.0. The dielectric loss angle tangent under 1MHz after thermofixation is preferably less than 0.06. The melt viscosity under 120 DEG C at a shear velocity below 50s<-1> is preferably more than 50 Pa*s and less than 3000 Pa*s. |
