| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To sufficiently secure conductivity between a shield layer and a ground electrode in an electronic circuit module. <P>SOLUTION: Columnar sections 10 whose front and rear end faces are almost fan-shaped and which communicate front and rear faces of a substrate are formed at four corners of a substrate 2a in an almost rectangular plane shape, in which a surface 21 is set to be a mounting face of an electronic component 3. Half-cut processing is performed on a peripheral side 26 of the substrate. The columnar section includes: a conductor wall face 11 which has an end face shape bent in an arc shape with four corner directions of the substrate as a center and continues in the front/rear face direction of the substrate; and a conductive hole filling resin 12 formed to cover the wall face and to border the four corners of an outer peripheral side of the substrate in the almost rectangular plane shape. The conductor wall face is directly connected to a ground electrode 6a on a rear face 22 side of the substrate and a shield layer 5a covers a half-cut processed region 23 on the peripheral side of the substrate and is fixed with the conductive hole filling resin at the four corners of the substrate. Thus, the shield layer 5a is connected to the ground electrodes via the hole filling resin and the conductor wall face in an electronic circuit module 1a. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
