Magnetic sensor integrated in a chip for detecting magnetic fields perpendicular to the chip and manufacturing process thereof

摘要

An integrated magnetic sensor formed by a semiconductor chip having a surface and accommodating a magnetic via and a sensing coil. The magnetic via is formed by a cylindrical layer of ferromagnetic material that extends perpendicular to the surface of the first chip and has in cross-section an annular shape of a circular or elliptical or curvilinear type. The sensing coil surrounds the magnetic via at a distance and is connected to an electronic circuit.

主权项

1. An integrated magnetic sensor comprising:
a first chip having a first surface; a magnetic via located in the first chip, the magnetic via including a cylindrical layer of ferromagnetic material that extends to the first surface of the first chip and has, in cross-section, an annular shape; a sensing coil located in the first chip and surrounding the magnetic via at a distance, the sensing coil being configured to produce a current in response to an external magnetic field; and an electronic circuit electrically coupled to the sensing coil and configured to process the current from the sensing coil and determine parameters of the external magnetic field.