发明名称 Electronic device case and surface treatment method thereof
摘要 An electronic device case and a surface treatment method thereof are provided in which an exterior case is diecast of an aluminum alloy, an aluminum alloy layer is deposited on an outer surface of the exterior case, an oxidized coating layer is formed on a surface of the aluminum alloy layer, and a sealing layer is formed atop the oxidized coating layer and may seal pores therein. A pigment colored layer may be formed between the oxidized coating layer and the sealing layer.
申请公布号 US9206522(B2) 申请公布日期 2015.12.08
申请号 US201213650735 申请日期 2012.10.12
申请人 Samsung Electronics Co., Ltd. 发明人 Cho Sung-Ho;Lee Woon-Sik
分类号 H05K5/04;B21C23/24;C25D11/16;C25D11/24 主分类号 H05K5/04
代理机构 Cha & Reiter, LLC 代理人 Cha & Reiter, LLC
主权项 1. An electronic device case comprising: an exterior case diecast of an aluminum alloy, the exterior case including a first surface having a plurality of pores; an aluminum alloy layer formed on the first surface of the exterior case, the aluminum alloy layer having a second surface that is in contact with the first surface of the exterior case, the second surface including a plurality of icicle-shaped structures that, extend into the pores; an oxidized coating layer formed on a surface of the aluminum alloy layer; and a sealing layer atop a third surface of the oxidized coating layer, wherein each of the icicle-shaped structures includes a centralized channel that is filled in by a respective portion of the oxidized coating layer.
地址 Yeongtong-gu, Suwon-si, Gyeonggi-do KR