| 发明名称 | In-situ monitoring system with monitoring of elongated region | ||
| 摘要 | A method of chemical mechanical polishing a substrate includes polishing a layer on the substrate at a polishing station, monitoring the layer during polishing at the polishing station with an in-situ monitoring system, the in-situ monitoring system monitoring an elongated region and generating a measured signal, computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate, modifying the measured signal based on the angle to generate a modified signal, and at least one of detecting a polishing endpoint or modifying a polishing parameter based on the modified signal. | ||
| 申请公布号 | US9205527(B2) | 申请公布日期 | 2015.12.08 |
| 申请号 | US201313791694 | 申请日期 | 2013.03.08 |
| 申请人 | Applied Materials, Inc. | 发明人 | Xu Kun;Shen Shih-Haur;Liu Tzu-Yu;Carlsson Ingemar;Iravani Hassan G.;Swedek Boguslaw A.;Tu Wen-Chiang;Bennett Doyle E. |
| 分类号 | B24B37/013;B24B37/04;B24B7/22 | 主分类号 | B24B37/013 |
| 代理机构 | Fish & Richardson P.C. | 代理人 | Fish & Richardson P.C. |
| 主权项 | 1. A method of chemical mechanical polishing a substrate, comprising: polishing a layer on the substrate at a polishing station; monitoring the layer during polishing at the polishing station with an in-situ monitoring system, the in-situ monitoring system monitoring an elongated region and generating a measured signal; computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate; modifying the measured signal based on the angle to generate a modified signal; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on the modified signal. | ||
| 地址 | Santa Clara CA US | ||