| 摘要 |
Provided is a surface-treated copper foil that exhibits satisfactory peel strength and affords satisfactory reduction of transmission loss even when employed in high-frequency circuit boards. The surface-treated copper foil of the present invention, in the following order, comprises: a copper foil; a metallic layer including one or more selected from a group consisting of Ni, Co, Zn, W, Mo, and Cr; and a surface-treated layer constituted by a chromium oxide, wherein the total deposition amount of the elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr is 200-2000 μg/dm^2 in the metallic layer, and, when the surface-treated copper foil is immersed in a 20 mass percent of nitric acid bath at 25°C for 30 seconds, with only the surface of the surface-treated layer exposed, after heat treatment at 250°C for 10 minutes was finished, an amount of copper dissolved in the nitric acid bath is equal to or less than 0.0030 g/25cm^2. |
