发明名称 |
Acoustic sensor |
摘要 |
Provided are an acoustic sensor and a method of manufacturing the same. The acoustic sensor includes a substrate including an acoustic chamber, a first hole, and a second hole, penetrating the substrate, a lower electrode pad extended onto a top surface of the substrate while covering a sidewall of the first hole, a diaphragm pad extended onto the top surface of the substrate while covering a sidewall of the second hole, a lower electrode provided on the acoustic chamber and connected to the lower electrode pad, and a diaphragm above the lower electrode while being separated from the lower electrode and connected to the diaphragm pad. |
申请公布号 |
US9210515(B2) |
申请公布日期 |
2015.12.08 |
申请号 |
US201414243755 |
申请日期 |
2014.04.02 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
Lee Jaewoo;Je Chang Han;Yang Woo Seok;Kwon Jong-Kee |
分类号 |
H04R25/00;H04R19/00 |
主分类号 |
H04R25/00 |
代理机构 |
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代理人 |
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主权项 |
1. An acoustic sensor comprising:
a substrate comprising an acoustic chamber, a first hole, and a second hole that penetrate the substrate, the first hole being spaced apart from the second hole; a lower electrode pad including a first portion and a second portion, the first portion disposed on a sidewall of the first hole, the second portion disposed on a top surface of the substrate and extending in a first direction; a diaphragm pad including a first portion and a second portion, the first portion disposed on a sidewall of the second hole, the second portion disposed on the top surface of the substrate and extending in a second direction; a lower electrode disposed over the acoustic chamber and connected to the second portion of the lower electrode pad; and a diaphragm disposed over the lower electrode and spaced apart from the lower electrode, the diaphragm being connected to the second portion of the diaphragm pad. |
地址 |
Daejeon KR |