Integration of optical components in integrated circuits

摘要

Methodologies enabling integration of optical components in ICs and a resulting device are disclosed. Embodiments include: providing a first substrate layer of an IC separated from a second substrate level by an insulator layer; providing a transistor on the second substrate layer; and providing an optical component on the first substrate layer, the optical component being connected to the transistor.

主权项

1. A method comprising:
providing a first substrate layer of an integrated circuit (IC) separated from a second substrate layer by an insulator layer; providing a transistor on the second substrate layer, the transistor being in direct contact with the second substrate layer; providing a waveguide on the first substrate layer, the waveguide being connected to the transistor; and providing a heat transfer via (HTV) extending vertically through a horizontal portion of the insulator layer and the first substrate layer, the HTV being adjacent to the second substrate layer and aligned vertically with the transistor, wherein the thickness of the insulator layer is greater than a thickness of the first substrate layer.