Rapid conductive cooling using a secondary process plane

摘要

In one embodiment, a substrate processing apparatus includes a chamber having an interior volume with an upper portion and a lower portion, a cooling source disposed in the upper portion of the interior volume, a heating source opposing the cooling source, a magnetically movable substrate support that moves between the upper portion and the lower the portion, and a plurality of sensors coupled to the chamber to detect the position of the substrate support relative to the heating source and the cooling source.

主权项

1. A method for thermally treating a substrate, comprising:
providing a chamber having a levitating substrate support disposed therein; sensing a position of the substrate support within the chamber; adjusting the position of the substrate support within the chamber; moving the substrate to a first position; heating the substrate in the first position; moving the substrate to a second position adjacent an active cooling means; and cooling the substrate in the second position, wherein the first and second positions are disposed in the chamber.