发明名称 CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 Disclosed is a circuit board which comprises a metal plate in a surface connected to a device, wherein the device can be electrically connected by exposing a connection pad through an opening in the metal plate. The circuit board can load the device. A connection terminal of the device and the connection pad of the circuit board can be connected by a wire or the like.
申请公布号 KR20150136865(A) 申请公布日期 2015.12.08
申请号 KR20140064494 申请日期 2014.05.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, YOUNG KWAN;KANG, MYUNG SAM;KOOK, SEUNG YEOP;KWON, KWANG HEE;LEE, SEUNG EUN;SUNG, KI JUNG
分类号 H05K3/32;H05K1/18 主分类号 H05K3/32
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