CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
摘要
Disclosed is a circuit board which comprises a metal plate in a surface connected to a device, wherein the device can be electrically connected by exposing a connection pad through an opening in the metal plate. The circuit board can load the device. A connection terminal of the device and the connection pad of the circuit board can be connected by a wire or the like.
申请公布号
KR20150136865(A)
申请公布日期
2015.12.08
申请号
KR20140064494
申请日期
2014.05.28
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, YOUNG KWAN;KANG, MYUNG SAM;KOOK, SEUNG YEOP;KWON, KWANG HEE;LEE, SEUNG EUN;SUNG, KI JUNG