Full perimeter chemical strengthening of substrates

摘要

Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.

主权项

1. An apparatus comprising:
a first glass substrate having a first surface and a second surface, the second surface created by the separation of the substrate from a larger glass sheet, the first surface previously strengthened with a chemical treatment and the second surface not strengthened with a chemical treatment; a second glass substrate having a third surface and a fourth surface, the fourth surface created by the separation of the substrate from the larger glass sheet, the third surface previously strengthened with a chemical treatment and the fourth surface not strengthened with a chemical treatment; a first thin film including one or more conductive traces formed on the first surface of the first glass substrate prior to the separation of the first substrate from the larger sheet; a second thin film including one or more conductive traces formed on the third surface of the second glass substrate prior to the separation of the second substrate from the larger sheet; a first sealant applied to a perimeter area of the first surface and not applied on the conductive traces on the first surface; and a second sealant applied to a perimeter area of the third surface and not applied on the conductive traces on the third surface, wherein the first sealant is mated with the second sealant to removably seal the first surface with the third surface, and wherein the first surface and the third surface are temporarily removably sealed when the first sealant on the first surface mates with the second sealant on the third surface such that the first sealant, the second sealant and the conductive traces occupy substantially all space between the first glass substrate and the second glass substrate.