| 发明名称 | Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part | ||
| 摘要 | A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted. | ||
| 申请公布号 | US9209527(B2) | 申请公布日期 | 2015.12.08 |
| 申请号 | US201313904072 | 申请日期 | 2013.05.29 |
| 申请人 | MURATA MANUFACTURING CO., LTD. | 发明人 | Nakano Kosuke;Takaoka Hidekiyo |
| 分类号 | B23K31/00;B23K31/02;H01R4/02;B23K35/02;B23K35/26;C22C9/05;C22C9/06;C22C13/00;C22C13/02;H05K3/34;B23K1/00 | 主分类号 | B23K31/00 |
| 代理机构 | Arent Fox LLP | 代理人 | Arent Fox LLP |
| 主权项 | 1. A joining method for joining a first metal member having at least a surface of a first metal to a second metal member having at least a surface of a second metal with a joining material predominantly of a joining metal having a lower melting point than at least one of the first metal and the second metal sandwiched between the first metal member and the second metal member, wherein the joining metal composing the joining material is Sn or an alloy containing Sn in an amount of 70% by weight or more, and at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the joining metal, and which has a lattice constant difference of 50% or more from the intermetallic compound produced on the surface of at least one of the first metal and the second metal, the joining method comprising: heat-treating the joining material located between the first metal member and the second metal member at a temperature at which the joining metal is melted to join the first metal member to the second metal member with the joining material sandwiched therebetween. | ||
| 地址 | Nagaokakyo-Shi, Kyoto-Fu JP | ||