Mechanisms for forming backside illuminated image sensor structure

摘要

Embodiments of mechanisms of a backside illuminated image sensor structure are provided. The backside illuminated image sensor structure includes a device substrate having a frontside and a backside and pixels formed at the frontside of the substrate. The backside illuminated image sensor structure further includes a metal element formed in a dielectric layer over the backside of the substrate and a color filter layer formed over the dielectric layer. In addition, the metal element is configured to form a light blocking area in the device substrate and is made of copper.

主权项

1. A method for forming a backside illuminated image sensor structure, comprising:
providing a device substrate having a plurality of pixels formed at a frontside of the device substrate; polishing a backside of the device substrate to expose the pixels; forming a dielectric layer over the backside of the device substrate; patterning the dielectric layer to form a trench in the dielectric layer; plating a metal layer in the trench and over the dielectric layer; polishing the metal layer to form a metal element; forming a color filter layer over the dielectric layer; and forming a microlens layer over the color filter layer.