Semiconductor device, method of manufacturing the same, and camera

摘要

A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.

主权项

1. A semiconductor device comprising:
a first member, including a chip mounting region and a peripheral region surrounding the chip mounting region; a semiconductor chip mounted in the chip mounting region; a second member which covers the semiconductor chip; and an adhesive arranged in a frame shape between the peripheral region and the second member to surround an entire periphery of the chip mounting region so as to bond the first member and the second member with each other, wherein a gap is locally formed between the adhesive and at least one of the first member and the second member to allow an internal space relative to the peripheral region to communicate with an external space relative to the peripheral region.