发明名称 |
Fabrication of shielded gate trench MOSFET with increased source-metal contact |
摘要 |
Fabricating a semiconductor device includes: forming a gate trench on a semiconductor substrate; forming a spacer inside the gate trench; forming one or more gate electrodes within the gate trench; implanting a body region; implanting a source region; forming a contact trench; disposing dielectric material within the gate trench; removing at least a portion of the dielectric material such that at least a portion of the source region extends above the dielectric material; and depositing a metal layer over at least a portion of a gate trench opening, at least a portion of the source region, and at least a portion of the contact trench. |
申请公布号 |
US9209260(B2) |
申请公布日期 |
2015.12.08 |
申请号 |
US201314086044 |
申请日期 |
2013.11.21 |
申请人 |
Alpha and Omega Semiconductor Incorporated |
发明人 |
Chen John |
分类号 |
H01L21/336;H01L29/40;H01L29/08;H01L29/66;H01L29/78;H01L21/265;H01L29/10;H01L29/417;H01L29/423;H01L29/45;H01L29/49 |
主分类号 |
H01L21/336 |
代理机构 |
Van Pelt, Yi & James LLP |
代理人 |
Van Pelt, Yi & James LLP |
主权项 |
1. A method for fabricating a semiconductor device, comprising:
forming a gate trench on a semiconductor substrate; forming a spacer inside the gate trench, including disposing a layer of spacer material in the gate trench, and removing at least a portion of the layer of spacer material from a bottom region of the gate trench to form the spacer; prior to substantially removing the spacer, forming a plurality of electrodes within the gate trench; substantially removing the spacer; forming a body region; forming a source region; forming a contact trench; disposing a dielectric material within the gate trench; removing at least a portion of the dielectric material such that a top surface of the source region extends above the dielectric material; and depositing a metal layer over at least a portion of a gate trench opening, at least a portion of the source region, and at least a portion of the contact trench. |
地址 |
Sunnyvale CA US |