发明名称 |
Dummy gate for a high voltage transistor device |
摘要 |
The present disclosure provides a semiconductor device. The semiconductor device includes a first doped region and a second doped region both formed in a substrate. The first and second doped regions are oppositely doped. The semiconductor device includes a first gate formed over the substrate. The first gate overlies a portion of the first doped region and a portion of the second doped region. The semiconductor device includes a second gate formed over the substrate. The second gate overlies a different portion of the second doped region. The semiconductor device includes a first voltage source that provides a first voltage to the second gate. The semiconductor device includes a second voltage source that provides a second voltage to the second doped region. The first and second voltages are different from each other. |
申请公布号 |
US9209183(B2) |
申请公布日期 |
2015.12.08 |
申请号 |
US201314036567 |
申请日期 |
2013.09.25 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Tsai Yung-Chih;Lin Han-Chung |
分类号 |
H01L27/092;H01L29/40;H01L29/78;H01L29/45;H01L29/49;H01L29/66 |
主分类号 |
H01L27/092 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A semiconductor device, comprising:
a first doped region and a second doped region both disposed in a substrate, the first and second doped regions having different types of conductivity; a first gate disposed over the substrate, the first gate overlying a portion of the first doped region and a portion of the second doped region, wherein an upper surface of the first gate is silicided; and a second gate disposed over the substrate, the second gate overlying a different portion of the second doped region, wherein an upper surface of the second gate is silicided. |
地址 |
Hsin-Chu TW |