Substrate with electrically isolated bond pads

摘要

A substrate for use in semiconductor device assembly has an electrically insulating body with a die mounting surface and an opposite grid array surface. An array of external electrical connection pads is located in the grid array surface. Substrate bond padsare located in the die mounting surface. Interconnects in the insulating body selectively interconnect the substrate bond padsto the external electrical connection pads. Tertiary bond pads are located in the die mounting surface and are electrically isolated from the external electrical connection pads.

主权项

1. A semiconductor device, comprising:
an electrically insulating substrate with a die mounting surface and an opposite grid array surface; an array of external electrical connection pads located in the grid array surface; substrate bond pads located in the die mounting surface; interconnects in the insulating body selectively connecting the substrate bond pads to the external electrical connection pads; tertiary bond pads located in the die mounting surface, wherein the tertiary bond pads are electrically isolated from the external electrical connection pads; a semiconductor die mounted on the die mounting surface of the substrate; first bond wires selectively connecting electrodes of the semiconductor die to the tertiary bond pads; second bond wires that selectively connect the substrate bond pads to the tertiary bond pads, wherein first selected ones of the second bond wires selectively connect one of the tertiary bond pads to at least two of the substrate bond pads.